Technology / Modular Firmware

One motor-control core. Many product possibilities.

Theta’s DTFC firmware separates a reusable motor-control library from application modules and microcontroller-specific drivers. Reuse the core, configure the product functions, and adapt the hardware interfaces for the selected MCU.

DTFC — Direct Torque and Flux Control logo
Theta motor-control technology · reusable firmware architecture
From the supplied firmware material

The layers behind the modules.

The supplied DTFC block diagram complements the interactive overview. Inspect the interfaces and the boundary between shared software and MCU-specific drivers.

DTFC modular software architectureArchitecture diagram supplied by Theta for DTFC in Modularity block diagram. The original blocks, connections, and layer labels are retained.
Modular firmware / Block diagram

Different products.
The same foundation.

Application behavior changes above the reusable control library. Hardware-specific interfaces change below it.

LAYER 01 / APPLICATION

Configure the product modules

Select a module to explore its role.

Load-unbalance analysis, extraction monitoring, motion sequences, HMI, and communication.

DTFC — Direct Torque and Flux Control logo
LAYER 02 / SYSTEM & CONTROL

Shared DTFC motor-control library

Reuse the core. Add or remove smart algorithms to match the project specifications.

LAYER 03 / HARDWARE ABSTRACTION

Standard interfaces

PWMADC / sensingTimingBoard interfaces
LAYER 04 / MCU DRIVERS

Adapt to the selected microcontroller

MCU vendor AMCU vendor BMCU vendor C
Application-specific modulesReusable control foundationTarget-specific adaptation

Conceptual architecture based on Theta’s modular-firmware material. The module names illustrate application scope; they are not a catalog of prequalified plug-and-play products. Each port requires integration and product verification.

Reuse above the hardware.

The motor-control library remains the shared foundation across applications and MCU platforms.

Change what the product needs.

Configure application functions and smart algorithms without recreating the whole software architecture.

Keep improvements moving forward.

Carry common fixes and engineering knowledge into the next project, supported by integration and regression testing.

Engineering approach

From architecture to application.

01 / ENGINEERING APPROACH

Keep the core. Configure the application.

The motor-control library is reused across applications. Smart algorithms are added or removed to match the project specifications, while the application layer defines the product behavior.

02 / ENGINEERING APPROACH

Choose the MCU around the product

Modular libraries and standard interfaces support portability across MCU vendors. Platform-specific drivers and hardware-abstraction layers absorb the target-hardware differences. Ports still require integration and verification of timing, peripherals, sensing, protections, and product behavior.

Read more engineering details
03 / ENGINEERING APPROACH

Reduce repeated engineering work

Reuse avoids rebuilding the control library for every product. Theta’s modular-firmware reference reports around 80% reuse of application-control software within a product line. The actual reuse depends on the product family and required functions.

04 / ENGINEERING APPROACH

Make reliability part of reuse

A shared codebase carries accumulated fixes and engineering knowledge into subsequent products. Common interfaces help contain application-specific changes and support focused regression testing. Reliability remains a product-level verification task.

05 / ENGINEERING APPROACH

Build for lower hardware cost

The supplied materials document a single-shunt DTFC implementation on Cortex-M0+ and an M0+ hardware reference. These provide options for evaluating lower-cost processors and current-sensing hardware against the application requirements.

06 / ENGINEERING APPROACH

Plan platform migration with evidence

The modular-firmware reference estimates about 3 to 5 weeks of effort for microcontroller-driver changes. This is a reference for adaptation effort, rather than a guaranteed elapsed schedule for a fully validated product port.

Engineering and hardware economics

Reduce cost through
the complete architecture.

Evaluate processor and sensing hardware together with software reuse, board integration, and the effort needed to maintain product variants.

Cortex-M0+

Processor cost options

The supplied materials document DTFC on an M0+ platform. Select processing resources for the complete application rather than the control algorithm alone.

Single shunt

Current-sensing options

A documented implementation supports evaluation of simpler sensing hardware. Current reconstruction, sampling windows, PWM, and the operating envelope determine suitability.

~80%

Application-code reuse

The modular-firmware reference reports this level within a product line. Reuse varies with the product family and functions required.

Where the savings can come from

A lower-cost MCU, fewer current-sensing components where appropriate, less repeated control-software development, and shared maintenance across product variants. The laundry material also identifies an integrated control-and-inverter board as a cost option compared with separate boards. Quantify the result with the actual BOM, development scope, and verification plan.

Source material: the supplied 2025 overview and WEG presentation document M0+ / single-shunt references; the modular-firmware material supports the reuse and portability description. These references and review notes are included for internal evaluation only and will be removed from the final website.

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